doc. no : qw0905- rev. : date : data sheet LHRF22740-PF 11 - sep. a - 2008 LHRF22740-PF-08 ligitek electronics co.,ltd. property of ligitek only lead-free parts pb super bright round type led lamps
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only part no.LHRF22740-PF package dimensions 1/5 page 1.0min 25.0min 5.0 3.0 3.8 0.5 typ 2.54typ 1.5 max 4.4 + - -60 60 0 100%50% 75%25% 25%75% 50%100% 0 -30 30
static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. ligitek electronics co.,ltd. property of ligitek only min. luminous intensity @20ma(mcd) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. LHRF22740-PF part no typical electrical & optical characteristics (ta=25 ) spectral halfwidth nm dominant wave length dnm forward voltage @ ma(v) red diffused lens algainp red material emitted color 20 630 1.52.4 min.max. 20 25 forward current i f peak forward current duty 1/10@10khz electrostatic discharge( * ) reverse current @5v power dissipation storage temperature operating temperature * tstg t opr -40 ~ +100 -40 ~ +85 esd ir i fp pd 2000 10 75 65 part no. LHRF22740-PF absolute maximum ratings at ta=25 parameter symbol ratings red viewing angle 2 1/2 (deg) typ. ma v a ma mw 2/5 page unit 54 300550
fig.3 forward voltage vs. temperature ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 0.8 40 020 1.1 1.0 0.9 1.2 ambient temperature( ) fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 80 60 0.0 0 -20 4060 20 1.5 1.0 2.0 2.5 80 forward voltage(v) fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 30 2.0 1.0 0 3.0 10 20 hrf chip 40 fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 0.0 1.0 2.0 forward current(ma) 101001000 ligitek electronics co.,ltd. property of ligitek only page 3/5 fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 550 0.0 0.5 650 1.0 700 0.5 01.52.5 50 60 part no.LHRF22740-PF
note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. time(sec) 5 /sec max 60 seconds max 2 /sec max 25 preheat 0 0 50 120 100 temp( c) 260 260 c/3sec max 150 part no. LHRF22740-PF dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5
1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test solderability test 1.t.sol=230 5 2.dwell time=5 1sec high temperature high humidity test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs low temperature storage test high temperature storage test operating life test part no.LHRF22740-PF reliability test: test itemtest condition mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. page 5/5 description reference standard ligitek electronics co.,ltd. property of ligitek only
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